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Passive Components

Paste

Exploring unlimited possibilities untapped in raw materials
As electronic devices become smaller, more functionally advanced, and with higher added value, requirements for materials more diversified. To respond to various needs, we provide a variety of thick film materials.

The composition of Noritake Co., Limited's thick film materials
Conductive Pastes
Series
The use
NP-1000 (Pt Paste) The electrode for sensor etc…
NP-2000 (Ag/Pt Paste) The electrode for Hybrid IC etc…
NP-3000 (Ag/Pd Paste) The inner and termination electrode for MLCC and C/R etc…
NP-4000 (Ag Paste) Practicable pastes lineup in the firing temperature range of 400~950℃. Possible to use as the electrode and Chip components etc…
NP-5000 (Au Paste) The electrode for Bonding
NP-6000 (Pd Paste) The inner electrode for MLCC etc…
NP-9000 (Base metal Pastes) Al, Ni, Cu pastes etc… Possible to use as the electrode of various electric devices.
D series (MO Pastes) The electrode for thermal head and Bonding Pat etc…
Dielectric Pastes
NP-7000 (Glass Pastes) Possible to use as the protection film and the marking, the dielectric film, the transparent dielectric of various electric devices.

Ag Paste of next generation
NP-4300 series
The termination electrode for MLCC and Chip components etc…

  1. Superior in soldering, to make no-plating become applicable.
  2. Superior in adhesives with a substrate.
  3. Simultaneous firing with inner electrode is possible.

Conductive Pastes
Article No.
NP-4320
Viscosity Can be set up as will
Recommendable conditions Formation conditions Dipping or Printing
Drying 170-185x10-15min
Firing temp. 780-850(Top Keep:10-15min)
Firing time 60min

NP-4100 series
The inner electrode for MLCC and Chip components etc…

  1. Matching with ceramics is good. (The shrinkage curve can be set up as will.)
  2. Heat resistance to make the firing at 950℃ become possible.(To substitute Ag/Pd becomes possible.)
  3. Low resistance can be kept even under high temperature.
  4. It is possible to form the fine of L/S=40/40μm at screen printing.
    Characteristic table:

Article No.

NP-4125A

NP-4125A1

NP-4125B1

NP-4125C1

NP-4125D1

Viscosity

Can be set up as will

Recommendable conditions

Mesh

SUS#200-325

Drying
70 ℃ ~x5min

Firing temp.

850~920 ℃

Printing thickness/Firing thickness

20~30μm/13~20μm

Sheetresistance(mΩ900 ℃ )

2

2

2

4

7

Firing shrinkage(%:900 ℃ )

15

14

8

4

2

Pt Paste NP-1000 Series

  • By high precise nature, it is possible to form continuation film even at least below 1μm.
  • By selection of the bonding, it is possible to correspond
  • By selection of powder and adding of sintering-control agents, it is possible to correspond to the firing at 1000~1500 ℃ . (Simultaneous firing with ceramics is possible)
  • It is possible to make patterning of 50μm line at screen-printing.

 

PT-021

PT-050

PT-081

Surface area(m 2 /g)

2.4

1.0

0.9

Particle diameter(μm)

0.2

0.6

0.8

Tap density(g/cc)

4.0-4.5

6.5-7.5

6.5-7.5

Heat resistance

Average

Good

Best

Dispersion

Average

Good

Best

Thin layer

Best

Good

Best